2025³â 09¿ù 11ÀÏ ¸ñ¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Sustainable Cooling: How LG¡¯s AI Data Center Cooling Solutions Help Tackle Global Water Scarcity

´º½ºÀÏÀÚ: 2025-05-03



SEOUL -- Driven by the rapid advancement of AI technologies, the data center construction market is expected to grow continuously over the next decade and possibly beyond.* AI data centers, with their intensive usage of high-powered chips, place greater demands on electricity and water resources and produce more heat than conventional data centers. For these reasons, energy-efficient thermal management solutions have emerged as critical infrastructure components for AI data centers – essential for keeping their servers at the optimal temperature and for minimizing their environmental impacts.

Conventional data centers typically utilize cooling towers to control internal temperatures. However, this method consumes large amounts of water – an increasingly critical concern given the growing threat of global water scarcity. A report from the World Resources Institute highlights that 25 countries currently experience extreme water stress each year, a number projected to double to 51 by 2050, impacting approximately 31 percent of the global population.

In response, AI data center operators are turning to more sustainable, water-efficient cooling solutions. Technologies such as air-cooled chillers (ACC) and direct-to-chip (D2C) cooling solutions are gaining traction as smart alternatives that minimize water usage without sacrificing performance.

At the 2025 Data Center World expo in Washington, D.C., LG showcased its latest lineup of sustainable cooling solutions. Leveraging its deep expertise in HVAC technology, LG is helping to shape a greener future for the data center industry.

An integral part of LG’s comprehensive suite of data center solutions is the ACC, which employs high-efficiency core components and low Global Warming Potential refrigerants to deliver a remarkable performance with fewer emissions and lower energy consumption. Available in both inverter screw and oil-free centrifugal types, the innovative ACC offers enhanced cooling capability with its “free-cooling” system that leverages a pumped refrigerant economizer to cut down on energy and water use.

LG has also introduced highly efficient D2C cooling solutions, such as its Cold Plate. When combined with an ACC, this solution is capable of implementing targeted heat removal to help reduce water usage. The system attaches directly to server chips, using a liquid coolant to absorb the heat and channel it through a closed-loop system managed by the Coolant Distribution Unit (CDU). The CDU features AI virtual sensors for full redundancy and boasts a compact, modular design for easy maintenance and installation.

To create the next generation of data center cooling solutions, LG opened a dedicated AIDC testing facility earlier this year at its LG AI Data Center HVAC Solution Lab. The lab is capable of conducting real-world simulations of data center environments, helping LG fine-tune its systems to meet evolving customer and environmental demands.

Through its ongoing research and innovation, LG is reinforcing its position as a global leader in sustainable data center cooling. By delivering solutions that cut energy use, reduce water consumption and maximize performance, LG is committed to supporting both the future of AI and the health of our planet.



 Àüü´º½º¸ñ·ÏÀ¸·Î

UL Solutions Opens First Commercial and Service Robot Testing Laboratory
Helical Fusion Raises JPY 2.3 Billion Series A, Advances Roadmap for World's First Steady-State Net Power Fusion Plant
Rimini Street, American Digital Team Up to Offer SAP, Oracle, VMware Support & Savings on HPE Infrastructure
Hamad Bin Khalifa University to Host Conference on AI Ethics
DNP to Open First Overseas R&D Center in the Netherlands
GCT Semiconductor Successfully Completes Sampling of 5G Chipsets and Modules to Lead Customers
European Commission Approves Tablet Formulation of BeOne Medicines¡¯ BRUKINSA¢ç for All Approved Indication

 

Kioxia Sampling UFS Ver. 4.1 Embedded Flash Memory Devices
Board Achieves Microsoft Solutions Partner Designation with Azure Cert...
IQM to Integrate Quantum Computer Into Oak Ridge National Laboratory¡¯...
LG Expands AI Infrastructure Footprint Across Asia
Omdia: China Hyperscalers Commercialize AI Amid Export Restrictions bu...
Rigaku Announces STAvesta, a Thermal Analyzer Tailor-made for Next-gen...
Toshiba Releases Automotive Photorelay in a Small Package that Achieve...

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚ Ç¥±â¿¡ ´ë¸¸½Ä À½Â÷ Ç¥±â '纽ÞÙó¢ ´Ï¿ì½ÃÁö' º´±â
º£³×ÇÁ·Ò º£³×ÀÎÅõ Áß¹® Ç¥±â 宝Ò¬ÜØÙÌ 宝Ò¬ì×öõ(ÜÄÒ¬ÜØÙÌ ÜÄ...
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®¿ìºê Alliuv ä¹备: ä¹联êó备, ¾Ë¶ã Althle ä¹÷åìÌ
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¹ÙÀÌ¿ÀÀÌ´Ï Bioini Áß¹® Ç¥±â ù±药研 ù±å·æÚ
¿À½ºÇÁ·Ò Ausfrom 奥ÞÙÜØÙÌ, À£ÇÁ·Ò Welfrom 卫ÜØÙÌ
¿¡³ÊÇÁ·Ò Enerfrom 额ÒöÜØÙÌ ¿¡³ÊÀ¯ºñ Eneruv 额Òöêó备
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØÙÌ ä¹ì³ÜØÙÌ

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..